Aluminum Nitride Ceramic Substrate For Thick Film Circuit

Aluminum Nitride (AlN) Ceramic Substrate for High-Performance Thick Film Circuits Puwei's Aluminum Nitride Ceramic Substrates provide the ultimate thermal management foundation for advanced thick film hybrid microcircuits. Engineered to excel in demanding electronic packaging applications, they combine exceptional thermal conductivity with superior electrical insulation, directly addressing heat dissipation and reliability challenges in modern power devices and high-frequency modules. This makes them an indispensable component for next-generation microelectronics. Core Benefits for Your Circuit Design Maximize Power Density & Reliability: Exceptional heat dissipation (170-230 W/m·K) prevents thermal runaway in high-power microelectronic components, enabling higher power in smaller packages and extending device lifespan. Ensure Signal Integrity: Excellent electrical insulation (Volume Resistivity >10¹⁴ Ω·cm) and stable dielectric properties are critical for microwave applica…